JPH0617088Y2 - 集積回路用ソケット - Google Patents
集積回路用ソケットInfo
- Publication number
- JPH0617088Y2 JPH0617088Y2 JP13683188U JP13683188U JPH0617088Y2 JP H0617088 Y2 JPH0617088 Y2 JP H0617088Y2 JP 13683188 U JP13683188 U JP 13683188U JP 13683188 U JP13683188 U JP 13683188U JP H0617088 Y2 JPH0617088 Y2 JP H0617088Y2
- Authority
- JP
- Japan
- Prior art keywords
- contact
- package
- integrated circuit
- socket
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims description 8
- 238000005259 measurement Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 3
- 241000272168 Laridae Species 0.000 description 2
- 239000005022 packaging material Substances 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Connecting Device With Holders (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13683188U JPH0617088Y2 (ja) | 1988-10-20 | 1988-10-20 | 集積回路用ソケット |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13683188U JPH0617088Y2 (ja) | 1988-10-20 | 1988-10-20 | 集積回路用ソケット |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0257076U JPH0257076U (en]) | 1990-04-25 |
| JPH0617088Y2 true JPH0617088Y2 (ja) | 1994-05-02 |
Family
ID=31397707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13683188U Expired - Lifetime JPH0617088Y2 (ja) | 1988-10-20 | 1988-10-20 | 集積回路用ソケット |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0617088Y2 (en]) |
-
1988
- 1988-10-20 JP JP13683188U patent/JPH0617088Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0257076U (en]) | 1990-04-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0090608B1 (en) | Semiconductor device with moulded package | |
| JP2565091B2 (ja) | 半導体装置およびその製造方法 | |
| JPS6238863B2 (en]) | ||
| JPH0617088Y2 (ja) | 集積回路用ソケット | |
| JPS63258050A (ja) | 半導体装置 | |
| JPS63296252A (ja) | 樹脂封止型半導体装置 | |
| JPS62118555A (ja) | 集積回路パツケ−ジ | |
| JPS61135145A (ja) | リ−ドフレ−ム | |
| KR910000018B1 (ko) | 리이드프레임을 갖춘 반도체장치 및 그 제조방법 | |
| JPH09330999A (ja) | リード変形防止パッケージ | |
| JPS6116702Y2 (en]) | ||
| JP2578704Y2 (ja) | Ｉｃソケット | |
| JPH0341476Y2 (en]) | ||
| JP3681856B2 (ja) | 樹脂封止型電子部品 | |
| JP2565115B2 (ja) | 集積回路パッケージ | |
| JPH0750380A (ja) | 半導体装置 | |
| JPH0212861A (ja) | 樹脂封止型半導体装置 | |
| JPS63181362A (ja) | リ−ドフレ−ム | |
| JP2881932B2 (ja) | 半導体装置 | |
| KR200148623Y1 (ko) | 큐에프피용 반도체 칩_ | |
| JPS6024047A (ja) | ダイオ−ド | |
| JPH04171856A (ja) | 樹脂封止型半導体装置およびその製造方法 | |
| JPH033354A (ja) | 半導体装置 | |
| JPH02105447A (ja) | Ｉｃ外部リード曲げ成形金型 | |
| JPH05152501A (ja) | 半導体装置 |